Download e-book for iPad: Design for Manufacturability and Statistical Design: A by Michael Orshansky

By Michael Orshansky

Layout for Manufacturability and Statistical layout: A complete technique provides a complete evaluate of equipment that must be mastered in realizing cutting-edge layout for manufacturability and statistical layout methodologies. widely, layout for manufacturability is a suite of concepts that try and repair the systematic resources of variability, corresponding to these as a result of photolithography and CMP. Statistical layout, however, bargains with the random resources of variability. either paradigms function inside of a typical framework, and their joint accomplished remedy is likely one of the goals of this ebook and an incredible differentation.

Show description

Read Online or Download Design for Manufacturability and Statistical Design: A Constructive Approach (Integrated Circuits and Systems) PDF

Best industrial engineering books

Download PDF by Michael Pfeifer: Materials Enabled Designs: The Materials Engineering

There are books aplenty on fabrics choice standards for engineering layout. such a lot conceal the actual and mechanical houses of particular fabrics, yet few supply a lot within the method of overall product layout standards. This cutting edge new text/reference will provide the ''Big picture'' view of ways fabrics can be selected-not just for a wanted functionality but additionally for his or her final functionality, toughness, upkeep, substitute bills, and so forth.

Get Fatigue Crack Growth Thresholds, Endurance Limits, and PDF

Top specialists offer 24 papers addressing 4 parts pertinent to fatigue crack progress thresholds: mechanisms, attempt strategies, research, and functions. Mechanisms: 3 mechanisms that impression thresholds are mentioned together with: crack-tip closure, surroundings, and Kmax results. A simplistic four-parameter version that describes FCG threshold habit of elastic-plastic fabrics can also be awarded.

New PDF release: Real Options in Engineering Design, Operations, and

On condition that engineering flexibility can probably offer a aggressive virtue, the query then turns into: accurately how helpful is that this flexibility? even though, conventional equipment frequently fail to safely trap the industrial price of investments in an atmosphere of common uncertainty and swift switch.

Additional resources for Design for Manufacturability and Statistical Design: A Constructive Approach (Integrated Circuits and Systems)

Example text

Fig. 7. (a) Topography after plating, illustrating array area bulges and recess, as well as both positive and negative step heights above plated lines resulting from superfill plating processes. (b) Topography after CMP, where the degree of dishing and erosion in the final post-CMP surface can be strongly influenced by the incoming profile that the CMP process experiences. 4 MULTILEVEL COPPER INTERCONNECT VARIATION The pattern dependent variations described above, arising from copper plating and CMP, can be exacerbated in multilevel interconnect structures.

First, a protective layer of oxide and a layer of thicker nitride on the surface of silicon are deposited. An isolation mask is used to define the trenches. The nitride is patterned and anisotropically etched into the silicon substrate, producing a trench with sharp vertical walls. A reactive ion etch (RIE) is used to etch the silicon trenches. The trench is then filled with oxide producing an isolation between the neighboring devices. Now, however, the oxide has to be removed so that oxide forming the STI and the silicon of active areas are co-planar [33].

Reprinted from [22], c 2003 SPIE). designer’s perspective, the variation of etching bias as a function of layout pattern density is the most important component. This dependence can be classified into three classes: micro- and macro-loading, and aspect-ratio-dependent etching. In aspect-ratio-dependent etching, the variation of linewidth is dependent on the distance to nearby features [26]. The biases due to photolithography and etching processes are additive. Micro-loading and macro-loading are driven by the common physical mechanism.

Download PDF sample

Rated 4.67 of 5 – based on 7 votes

About the Author